data sheet semiconductor http://www.yeashin.com 1 rev.02 20120305 kbpc35005 thru KBPC3510 voltage range 50 to 1000 volts current 35 ampere features ?e low cost ?e this series is ul recognized under component index, file number e127707 ?e high forward surge current capability ?e integrally molded heatsink provide very low thermal resistance. ?e high isolation voltage from case to lugs. ?e high temperature soldering guaranteed: 260 j /10 second, at 5 lbs. (2.3kg) tension. ?e high temperature soldering : 260 o c / 10 seconds at terminals ?e pb free product at available : 99% sn above meet rohs environment substance directive request mechanical data ?e case: metal case ?e terminal: plated 0.25" (6.35mm) lug. ?e polarity: polarity symbols marked on case. ?e mounting: thru hole for #10 scre w, 20 in,- lbs. torqute max. ?e weight: 1.02 ounce, 29gram maximum ratings and electrical characteristics ?e ratings at 25 j ambient temperature unless otherwise specified ?e single phase, half wave, 60hz, re sistive or inductive load. ?e for capacitive load derate current by 20% kbpc 35005 kbpc 3501 kbpc 3502 kbpc 3504 kbpc 3506 kbpc 3508 kbpc 35 10 symbols unit maximum repetitive peak reverse voltage vrrm 50 100 200 400 600 800 1000 volts maximum rms voltage vrms 35 70 140 280 420 560 700 volts maximum dc blocking voltage vdc 50 100 200 400 600 800 1000 volts maximum average forward rectified output current, at tc = 50 j (note 1, 2) i(av) 35 amps peak forward surge current 8.3ms single half sine - wave superimposed on rated load (jedec method ) ifsm 400 amps rating for fusing (t<8.3ms) i2t 664 a2s maximum instantaneous forward voltage drop per bridge element at 17.5a vf 1.1 volts ta = 25 j 10 g a maximum dc reverse current at rate dc blocking voltage per element ta =100 j ir 1.0 ma isolation voltage from case to lugs viso 2500 vac typical thermal resistance (note 1,2) r c jc 2.0 j /w operating temp erature range tj (-65 to +150) storage temperature range tstg (-65 to +150) j 1. unit mounted on 9" x 3.5" x 4.6" (23cm x 9cm x 11.8cm)al. finned plate. 2. bolt down on heat-sink with silicon thermal compound between bridge and mounting sutfae for maximum heat transfer efficiency with # 10 screw. mb-35 unit:inch(mm) parameter
http://www.yeashin.com 2 rev.02 20120305 kbpc35005 thru KBPC3510 device characteristics instantaneou s reverse current, instan taneous forward current, percent of rated peak reverse voltage,(%) t =25 c 60 capacitive j j max fig.6-maximum power dissipation average output current, average power di ssipation of brid ge, junction capacitance,(pf) revrese voltage,(v) 10 0.1 1.0 10 100 0 0 5 10 1%duty cycle pulse width=300us 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 t =25 c fig.5-typical junction capacitance instantaneous forward voltage,(v) 100 =50mv j sig v f=1mhz t =25 c p-p 1000 0.01 0.1 (a) 1.0 j 40 20 (w) 60 load t =t 80 100 0 0.01 40 20 1.0 0.1 j 25 load 15 20 30 35 resistive inductive or 100 80 120 140 forward surge current per element 8 fig.4-typical reverse characteristics t =100 c fig.2-maximum non-repetitive peak number of cycles at 60 hz (jedec method) =t 8.3ms single half sine-wave output rectified current per bridge element fig.3-typical forward characteristics case temperature, ( c) 50 0 10 100 average forward output single phase inductive or resistive half wave 60hz load 0 10 current,(a) 20 35 30 125 10 (ua) j 100 heat sink mounting current, (a) peak forward surge 100 0 1 300 200 2 4 6 500 400 700 600 1 cycle fig.1-derating curve for 20 10 40 60 100 j max j t 9"x 3.5"x 4.6" thick (23 x 9 x 11.8cm) al.finned plate per bridge element per bridge element 150 175 100 25 75 (a)
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